1#
2# Generic thermal sysfs drivers configuration
3#
4
5menuconfig THERMAL
6	tristate "Generic Thermal sysfs driver"
7	help
8	  Generic Thermal Sysfs driver offers a generic mechanism for
9	  thermal management. Usually it's made up of one or more thermal
10	  zone and cooling device.
11	  Each thermal zone contains its own temperature, trip points,
12	  cooling devices.
13	  All platforms with ACPI thermal support can use this driver.
14	  If you want this support, you should say Y or M here.
15
16if THERMAL
17
18config THERMAL_HWMON
19	bool
20	prompt "Expose thermal sensors as hwmon device"
21	depends on HWMON=y || HWMON=THERMAL
22	default y
23	help
24	  In case a sensor is registered with the thermal
25	  framework, this option will also register it
26	  as a hwmon. The sensor will then have the common
27	  hwmon sysfs interface.
28
29	  Say 'Y' here if you want all thermal sensors to
30	  have hwmon sysfs interface too.
31
32config THERMAL_OF
33	bool
34	prompt "APIs to parse thermal data out of device tree"
35	depends on OF
36	default y
37	help
38	  This options provides helpers to add the support to
39	  read and parse thermal data definitions out of the
40	  device tree blob.
41
42	  Say 'Y' here if you need to build thermal infrastructure
43	  based on device tree.
44
45config THERMAL_WRITABLE_TRIPS
46	bool "Enable writable trip points"
47	help
48	  This option allows the system integrator to choose whether
49	  trip temperatures can be changed from userspace. The
50	  writable trips need to be specified when setting up the
51	  thermal zone but the choice here takes precedence.
52
53	  Say 'Y' here if you would like to allow userspace tools to
54	  change trip temperatures.
55
56choice
57	prompt "Default Thermal governor"
58	default THERMAL_DEFAULT_GOV_STEP_WISE
59	help
60	  This option sets which thermal governor shall be loaded at
61	  startup. If in doubt, select 'step_wise'.
62
63config THERMAL_DEFAULT_GOV_STEP_WISE
64	bool "step_wise"
65	select THERMAL_GOV_STEP_WISE
66	help
67	  Use the step_wise governor as default. This throttles the
68	  devices one step at a time.
69
70config THERMAL_DEFAULT_GOV_FAIR_SHARE
71	bool "fair_share"
72	select THERMAL_GOV_FAIR_SHARE
73	help
74	  Use the fair_share governor as default. This throttles the
75	  devices based on their 'contribution' to a zone. The
76	  contribution should be provided through platform data.
77
78config THERMAL_DEFAULT_GOV_USER_SPACE
79	bool "user_space"
80	select THERMAL_GOV_USER_SPACE
81	help
82	  Select this if you want to let the user space manage the
83	  platform thermals.
84
85config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
86	bool "power_allocator"
87	select THERMAL_GOV_POWER_ALLOCATOR
88	help
89	  Select this if you want to control temperature based on
90	  system and device power allocation. This governor can only
91	  operate on cooling devices that implement the power API.
92
93endchoice
94
95config THERMAL_GOV_FAIR_SHARE
96	bool "Fair-share thermal governor"
97	help
98	  Enable this to manage platform thermals using fair-share governor.
99
100config THERMAL_GOV_STEP_WISE
101	bool "Step_wise thermal governor"
102	help
103	  Enable this to manage platform thermals using a simple linear
104	  governor.
105
106config THERMAL_GOV_BANG_BANG
107	bool "Bang Bang thermal governor"
108	default n
109	help
110	  Enable this to manage platform thermals using bang bang governor.
111
112	  Say 'Y' here if you want to use two point temperature regulation
113	  used for fans without throttling.  Some fan drivers depend on this
114	  governor to be enabled (e.g. acerhdf).
115
116config THERMAL_GOV_USER_SPACE
117	bool "User_space thermal governor"
118	help
119	  Enable this to let the user space manage the platform thermals.
120
121config THERMAL_GOV_POWER_ALLOCATOR
122	bool "Power allocator thermal governor"
123	help
124	  Enable this to manage platform thermals by dynamically
125	  allocating and limiting power to devices.
126
127config CPU_THERMAL
128	bool "generic cpu cooling support"
129	depends on CPU_FREQ
130	depends on THERMAL_OF
131	help
132	  This implements the generic cpu cooling mechanism through frequency
133	  reduction. An ACPI version of this already exists
134	  (drivers/acpi/processor_thermal.c).
135	  This will be useful for platforms using the generic thermal interface
136	  and not the ACPI interface.
137
138	  If you want this support, you should say Y here.
139
140config CLOCK_THERMAL
141	bool "Generic clock cooling support"
142	depends on COMMON_CLK
143	depends on PM_OPP
144	help
145	  This entry implements the generic clock cooling mechanism through
146	  frequency clipping. Typically used to cool off co-processors. The
147	  device that is configured to use this cooling mechanism will be
148	  controlled to reduce clock frequency whenever temperature is high.
149
150config DEVFREQ_THERMAL
151	bool "Generic device cooling support"
152	depends on PM_DEVFREQ
153	depends on PM_OPP
154	help
155	  This implements the generic devfreq cooling mechanism through
156	  frequency reduction for devices using devfreq.
157
158	  This will throttle the device by limiting the maximum allowed DVFS
159	  frequency corresponding to the cooling level.
160
161	  In order to use the power extensions of the cooling device,
162	  devfreq should use the simple_ondemand governor.
163
164	  If you want this support, you should say Y here.
165
166config THERMAL_EMULATION
167	bool "Thermal emulation mode support"
168	help
169	  Enable this option to make a emul_temp sysfs node in thermal zone
170	  directory to support temperature emulation. With emulation sysfs node,
171	  user can manually input temperature and test the different trip
172	  threshold behaviour for simulation purpose.
173
174	  WARNING: Be careful while enabling this option on production systems,
175	  because userland can easily disable the thermal policy by simply
176	  flooding this sysfs node with low temperature values.
177
178config HISI_THERMAL
179	tristate "Hisilicon thermal driver"
180	depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST
181	help
182	  Enable this to plug hisilicon's thermal sensor driver into the Linux
183	  thermal framework. cpufreq is used as the cooling device to throttle
184	  CPUs when the passive trip is crossed.
185
186config IMX_THERMAL
187	tristate "Temperature sensor driver for Freescale i.MX SoCs"
188	depends on CPU_THERMAL
189	depends on MFD_SYSCON
190	depends on OF
191	help
192	  Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
193	  It supports one critical trip point and one passive trip point.  The
194	  cpufreq is used as the cooling device to throttle CPUs when the
195	  passive trip is crossed.
196
197config SPEAR_THERMAL
198	bool "SPEAr thermal sensor driver"
199	depends on PLAT_SPEAR || COMPILE_TEST
200	depends on OF
201	help
202	  Enable this to plug the SPEAr thermal sensor driver into the Linux
203	  thermal framework.
204
205config ROCKCHIP_THERMAL
206	tristate "Rockchip thermal driver"
207	depends on ARCH_ROCKCHIP || COMPILE_TEST
208	depends on RESET_CONTROLLER
209	help
210	  Rockchip thermal driver provides support for Temperature sensor
211	  ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
212	  trip point. Cpufreq is used as the cooling device and will throttle
213	  CPUs when the Temperature crosses the passive trip point.
214
215config RCAR_THERMAL
216	tristate "Renesas R-Car thermal driver"
217	depends on ARCH_SHMOBILE || COMPILE_TEST
218	depends on HAS_IOMEM
219	help
220	  Enable this to plug the R-Car thermal sensor driver into the Linux
221	  thermal framework.
222
223config KIRKWOOD_THERMAL
224	tristate "Temperature sensor on Marvell Kirkwood SoCs"
225	depends on MACH_KIRKWOOD || COMPILE_TEST
226	depends on OF
227	help
228	  Support for the Kirkwood thermal sensor driver into the Linux thermal
229	  framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
230
231config DOVE_THERMAL
232	tristate "Temperature sensor on Marvell Dove SoCs"
233	depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
234	depends on OF
235	help
236	  Support for the Dove thermal sensor driver in the Linux thermal
237	  framework.
238
239config DB8500_THERMAL
240	bool "DB8500 thermal management"
241	depends on ARCH_U8500
242	default y
243	help
244	  Adds DB8500 thermal management implementation according to the thermal
245	  management framework. A thermal zone with several trip points will be
246	  created. Cooling devices can be bound to the trip points to cool this
247	  thermal zone if trip points reached.
248
249config ARMADA_THERMAL
250	tristate "Armada 370/XP thermal management"
251	depends on ARCH_MVEBU || COMPILE_TEST
252	depends on OF
253	help
254	  Enable this option if you want to have support for thermal management
255	  controller present in Armada 370 and Armada XP SoC.
256
257config TEGRA_SOCTHERM
258	tristate "Tegra SOCTHERM thermal management"
259	depends on ARCH_TEGRA
260	help
261	  Enable this option for integrated thermal management support on NVIDIA
262	  Tegra124 systems-on-chip. The driver supports four thermal zones
263	  (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
264	  zones to manage temperatures. This option is also required for the
265	  emergency thermal reset (thermtrip) feature to function.
266
267config DB8500_CPUFREQ_COOLING
268	tristate "DB8500 cpufreq cooling"
269	depends on ARCH_U8500
270	depends on CPU_THERMAL
271	default y
272	help
273	  Adds DB8500 cpufreq cooling devices, and these cooling devices can be
274	  bound to thermal zone trip points. When a trip point reached, the
275	  bound cpufreq cooling device turns active to set CPU frequency low to
276	  cool down the CPU.
277
278config INTEL_POWERCLAMP
279	tristate "Intel PowerClamp idle injection driver"
280	depends on THERMAL
281	depends on X86
282	depends on CPU_SUP_INTEL
283	help
284	  Enable this to enable Intel PowerClamp idle injection driver. This
285	  enforce idle time which results in more package C-state residency. The
286	  user interface is exposed via generic thermal framework.
287
288config X86_PKG_TEMP_THERMAL
289	tristate "X86 package temperature thermal driver"
290	depends on X86_THERMAL_VECTOR
291	select THERMAL_GOV_USER_SPACE
292	select THERMAL_WRITABLE_TRIPS
293	default m
294	help
295	  Enable this to register CPU digital sensor for package temperature as
296	  thermal zone. Each package will have its own thermal zone. There are
297	  two trip points which can be set by user to get notifications via thermal
298	  notification methods.
299
300config INTEL_SOC_DTS_IOSF_CORE
301	tristate
302	depends on X86
303	select IOSF_MBI
304	help
305	  This is becoming a common feature for Intel SoCs to expose the additional
306	  digital temperature sensors (DTSs) using side band interface (IOSF). This
307	  implements the common set of helper functions to register, get temperature
308	  and get/set thresholds on DTSs.
309
310config INTEL_SOC_DTS_THERMAL
311	tristate "Intel SoCs DTS thermal driver"
312	depends on X86
313	select INTEL_SOC_DTS_IOSF_CORE
314	select THERMAL_WRITABLE_TRIPS
315	help
316	  Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
317	  temperature sensor (DTS). These SoCs have two additional DTSs in
318	  addition to DTSs on CPU cores. Each DTS will be registered as a
319	  thermal zone. There are two trip points. One of the trip point can
320	  be set by user mode programs to get notifications via Linux thermal
321	  notification methods.The other trip is a critical trip point, which
322	  was set by the driver based on the TJ MAX temperature.
323
324config INTEL_QUARK_DTS_THERMAL
325	tristate "Intel Quark DTS thermal driver"
326	depends on X86_INTEL_QUARK
327	help
328	  Enable this to register Intel Quark SoC (e.g. X1000) platform digital
329	  temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
330	  The DTS will be registered as a thermal zone. There are two trip points:
331	  hot & critical. The critical trip point default value is set by
332	  underlying BIOS/Firmware.
333
334config INT340X_THERMAL
335	tristate "ACPI INT340X thermal drivers"
336	depends on X86 && ACPI
337	select THERMAL_GOV_USER_SPACE
338	select ACPI_THERMAL_REL
339	select ACPI_FAN
340	select INTEL_SOC_DTS_IOSF_CORE
341	select THERMAL_WRITABLE_TRIPS
342	help
343	  Newer laptops and tablets that use ACPI may have thermal sensors and
344	  other devices with thermal control capabilities outside the core
345	  CPU/SOC, for thermal safety reasons.
346	  They are exposed for the OS to use via the INT3400 ACPI device object
347	  as the master, and INT3401~INT340B ACPI device objects as the slaves.
348	  Enable this to expose the temperature information and cooling ability
349	  from these objects to userspace via the normal thermal framework.
350	  This means that a wide range of applications and GUI widgets can show
351	  the information to the user or use this information for making
352	  decisions. For example, the Intel Thermal Daemon can use this
353	  information to allow the user to select his laptop to run without
354	  turning on the fans.
355
356config ACPI_THERMAL_REL
357	tristate
358	depends on ACPI
359
360config INTEL_PCH_THERMAL
361	tristate "Intel PCH Thermal Reporting Driver"
362	depends on X86 && PCI
363	help
364	  Enable this to support thermal reporting on certain intel PCHs.
365	  Thermal reporting device will provide temperature reading,
366	  programmable trip points and other information.
367
368menu "Texas Instruments thermal drivers"
369depends on ARCH_HAS_BANDGAP || COMPILE_TEST
370source "drivers/thermal/ti-soc-thermal/Kconfig"
371endmenu
372
373menu "Samsung thermal drivers"
374depends on ARCH_EXYNOS || COMPILE_TEST
375source "drivers/thermal/samsung/Kconfig"
376endmenu
377
378menu "STMicroelectronics thermal drivers"
379depends on ARCH_STI && OF
380source "drivers/thermal/st/Kconfig"
381endmenu
382
383config QCOM_SPMI_TEMP_ALARM
384	tristate "Qualcomm SPMI PMIC Temperature Alarm"
385	depends on OF && SPMI && IIO
386	select REGMAP_SPMI
387	help
388	  This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
389	  PMIC devices. It shows up in sysfs as a thermal sensor with multiple
390	  trip points. The temperature reported by the thermal sensor reflects the
391	  real time die temperature if an ADC is present or an estimate of the
392	  temperature based upon the over temperature stage value.
393
394endif
395